• Search by Printer
  • Register
  • Wishlist (0)
  • Recently viewed products
  • Compare products list
You have no items in your shopping cart.
Menu
Transcend MTS952T2 M.2 512 GB Serial ATA III 3D NAND1
Transcend MTS952T2 M.2 512 GB Serial ATA III 3D NAND1
Transcend MTS952T2 M.2 512 GB Serial ATA III 3D NAND2

Transcend MTS952T2 M.2 512 GB Serial ATA III 3D NAND

Transcend MTS952T2. SSD capacity: 512 GB, SSD form factor: M.2, Read speed: 560 MB/s, Write speed: 520 MB/s, Data transfer rate: 6 Gbit/s, Component for: PC
Manufacturer: Transcend
SKU: 6178278
Manufacturer part number: TS512GMTS952T2
$99.99
Transcend's MTS952T2 M.2 SSD features the SATA III 6Gb/s interface, delivering superior transfer speeds. The MTS952T2 features the latest 3D NAND technology for high storage efficiency, 30µ" PCB gold finger and Corner Bond technology for enhanced durability, built-in DRAM cache for fast access, an extended operating temperature range from -20°C to 75°C, and an endurance rating of 3K Program/Erase cycles for reliable operation.

 

  • DRAM Cache embedded
  • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
  • 30µ" PCB gold finger
  • Key components fortified by default with Corner Bond technology
  • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
  • Dynamic Thermal Throttling
  • Advanced Global Wear-Leveling and Block management for reliability
  • Advanced Garbage Collection
  • Built-in LDPC ECC (Error Correction Code) functionality
  • Enhanced S.M.A.R.T. function for durability
Transcend's MTS952T2 M.2 SSD features the SATA III 6Gb/s interface, delivering superior transfer speeds. The MTS952T2 features the latest 3D NAND technology for high storage efficiency, 30µ" PCB gold finger and Corner Bond technology for enhanced durability, built-in DRAM cache for fast access, an extended operating temperature range from -20°C to 75°C, and an endurance rating of 3K Program/Erase cycles for reliable operation.

 

  • DRAM Cache embedded
  • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
  • 30µ" PCB gold finger
  • Key components fortified by default with Corner Bond technology
  • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
  • Dynamic Thermal Throttling
  • Advanced Global Wear-Leveling and Block management for reliability
  • Advanced Garbage Collection
  • Built-in LDPC ECC (Error Correction Code) functionality
  • Enhanced S.M.A.R.T. function for durability

Products specifications

Attribute name Attribute value
Depth 0.141"
Width 3.15"
Height 0.866"
Weight 0.317 oz
DevSlp (device sleep) support Y
Technical details
Sustainability certificates RoHS
Ports & interfaces
Interface Serial ATA III
Design
Certification CE, FCC, BSMI
Operational conditions
Minimum operating temperature -20 °C
Maximum operating temperature 75 °C
Operating temperature (T-T) -20 - 75 °C
Storage temperature (T-T) -55 - 85 °C
Operating relative humidity (H-H) 5 - 95 %
Operating shock 1500 G
Operating vibration 20 G
Power
Power consumption (sleep) 0.4 W
Operating voltage 3.3 V
Features
Component for PC
ECC Y
Data transfer rate 6 Gbit/s
Mean time between failures (MTBF) 3000000 h
SSD capacity 512 GB
Memory type 3D NAND
Read speed 560 MB/s
Write speed 520 MB/s
Random read (4KB) 95000 IOPS
S.M.A.R.T. support Y
Native Command Queuing (NCQ) Y
Random write (4KB) 85000 IOPS
TRIM support Y
SSD form factor M.2

Product tags

  • (51242)
/* Added for Digitol */ /* End Added for Digitol */