Transcend MTE662T2 M.2 1000 GB PCI Express 3.0 3D NAND NVMe

Transcend MTE662T2. SSD capacity: 1000 GB, SSD form factor: M.2, Read speed: 3500 MB/s, Write speed: 2700 MB/s, Component for: PC/notebook
Manufacturer: Transcend
SKU: 6626447
Manufacturer part number: TS1TMTE662T2
GTIN: 0760557844617
$554.70
Transcend's MTE662T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662T2 features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662T2 is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃~75℃.

 

  • DRAM Cache embedded
  • 30µ" PCB gold finger
  • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
  • PCIe Gen 3 x4 interface
  • Key components fortified by default with Corner Bond technology
  • Compliant with PCI Express specification 3.1
  • Compliant with NVM Express specification 1.3
  • Supports NVM command
  • SLC caching technology
  • Built-in LDPC ECC (Error Correction Code) functionality
Transcend's MTE662T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662T2 features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662T2 is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃~75℃.

 

  • DRAM Cache embedded
  • 30µ" PCB gold finger
  • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
  • PCIe Gen 3 x4 interface
  • Key components fortified by default with Corner Bond technology
  • Compliant with PCI Express specification 3.1
  • Compliant with NVM Express specification 1.3
  • Supports NVM command
  • SLC caching technology
  • Built-in LDPC ECC (Error Correction Code) functionality

Products specifications

Attribute name Attribute value
TBW rating 4400
Width 3.15"
Depth 0.866"
Height 0.141"
Weight 0.317 oz
PCI Express interface data lanes x4
NVMe version 1.3
Technical details
Sustainability certificates RoHS
Ports & interfaces
Interface PCI Express 3.0
Design
Certification CE, FCC, BSMI
Operational conditions
Minimum operating temperature -20 °C
Maximum operating temperature 75 °C
Operating temperature (T-T) -20 - 75 °C
Storage temperature (T-T) -55 - 85 °C
Operating shock 1500 G
Operating vibration 20 G
Power
Power consumption (sleep) 1 W
Operating voltage 3.3 V
Features
Random read (4KB) 340000 IOPS
Random write (4KB) 355000 IOPS
Component for PC/notebook
ECC Y
Mean time between failures (MTBF) 3000000 h
SSD capacity 1000 GB
Memory type 3D NAND
Read speed 3500 MB/s
Write speed 2700 MB/s
NVMe Y
SSD form factor M.2

Product tags

  • (51242)
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