Intel BBS7200APL motherboard Intel® C612 LGA 3647 (Socket P)

Intel BBS7200APL. Processor manufacturer: Intel, Processor socket: LGA 3647 (Socket P), Compatible processor series: Intel® Xeon Phi™. Supported memory types: DDR4-SDRAM, Maximum internal memory: 384 GB, Memory channels: Hexa-channel. Ethernet interface type: Gigabit Ethernet. Component for: Server, Motherboard chipset: Intel® C612, Market segment: Server. Width: 6.8" (172.7 mm), Depth: 14.2" (360.7 mm)
Manufacturer: Intel
SKU: 4974060
Manufacturer part number: BBS7200APL
GTIN: 5032037090124
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
TPM Version TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.
Integrated BMC with IPMI IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
Intel® Quiet Thermal Technology Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.
Intel® Build Assurance Technology Intel® Build Assurance technology provides advanced diagnostic features ensuring the most comprehensively tested, most thoroughly debugged, and most stable systems possible are shipped to customers.
Intel® Efficient Power Technology Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.
Intel® Fast Memory Access Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.
Intel® Flex Memory Access Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.
Intel® Remote Management Module Support The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).
Intel® Advanced Management Technology Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.
Intel® Server Customization Technology Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.
Intel® I/O Acceleration Technology Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.
Intel® Rapid Storage Technology enterprise Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.
Intel® Node Manager Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
TPM Version TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.
Integrated BMC with IPMI IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
Intel® Quiet Thermal Technology Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.
Intel® Build Assurance Technology Intel® Build Assurance technology provides advanced diagnostic features ensuring the most comprehensively tested, most thoroughly debugged, and most stable systems possible are shipped to customers.
Intel® Efficient Power Technology Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.
Intel® Fast Memory Access Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.
Intel® Flex Memory Access Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.
Intel® Remote Management Module Support The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).
Intel® Advanced Management Technology Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.
Intel® Server Customization Technology Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.
Intel® I/O Acceleration Technology Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.
Intel® Rapid Storage Technology enterprise Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.
Intel® Node Manager Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
Products specifications
Attribute nameAttribute value
Product seriesIntel® Server Board S7200AP Family
Processor number of cores supported64,68
Packaging content(10) Intel Server Board S7200APL
Additional information URLhttp://www.intel.com/content/www/us/en/support/server-products/server-boards/single-socket-server-boards/intel-server-board-s7200ap-family.html
Supported RAID configurationIntel® Embedded Server RAID Technology (ESRT2)
Motherboard ARK ID95779
Integrated systems availableN
Width6.8"
Depth14.2"
Maximum Memory384 GB
On-board graphics cardY
Motherboard chipsetIntel® C612
Trusted Platform Module (TPM)Y
PCI Express x16 (Gen 3.x) slots2
Harmonized System (HS) code8473301180
Market segmentServer
StatusDiscontinued
Last change63903513
Export Control Classification Number (ECCN)5A992CN3
Supported memory typesDDR4-SDRAM
Number of SATA connectors1
Number of DIMM slots6
Number of processors supported1
Intel Remote Management Module SupportY
Intel Intelligent Power Node ManagerY
Intel Server Management SoftwareY
Rack-Friendly boardY
Intel Node ManagerY
Intel Advanced Management TechnologyY
Intel Rapid Storage Technology enterpriseY
Intel Build Assurance TechnologyY
Intel Quiet Thermal TechnologyY
Intel Efficient Power TechnologyY
Intel Server Customization TechnologyY
PCI Express CEM revision3.0
Intel I/O Acceleration TechnologyY
Maximum internal memory384 GB
Memory bandwidth (max)512 GB/s
Total number of SATA connectors1
Product familySingle-socket server board
Launch dateQ2'16
Product codenameAdams Pass
Intel Xeon seriesPhi
Trusted Platform Module (TPM) version2.0
Expected discontinuance dateQ2'18
End of life date announceMonday, April 30, 2018
Last order dateSunday, September 30, 2018
Last receipt attributes dateSunday, December 30, 2018
Graphics outputInternal RGB Video Header
Riser slot 1 number of lanes16
Riser slot 2 number of lanes16
Intel Quiet System Technology (QST)Y
Intel Quick Resume TechnologyY
Ports & interfaces
Ethernet LAN (RJ-45) ports2
USB ports quantity2
Serial ports quantity1
USB version3.2 Gen 1 (3.1 Gen 1)
VGA (D-Sub) ports quantity1
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity2
Design
Form factorCustom 6.8" x 14.2"
Chassis typeRack (2)
Features
Component forServer
ECCY
Memory channelsHexa-channel
Product typeServer/Workstation Board
Performance
Ethernet LANY
Compatible processor seriesIntel® Xeon Phi™
Network
Ethernet interface typeGigabit Ethernet
Wi-FiN
Processor
Thermal Design Power (TDP)215 W
Processor manufacturerIntel
CPU configuration (max)1
ECC supported by processorY
PCI Express slots version3.0
Processor socketLGA 3647 (Socket P)
Maximum internal memory supported by processor384 GB
Memory bandwidth supported by processor (max)512 GB/s
Processor special features
Embedded options availableN
Intel Fast Memory AccessY
Intel Flex Memory AccessY
Intel Trusted Execution TechnologyY
Intel® AES New Instructions (Intel® AES-NI)Y
Maximum number of PCI Express lanes32
Product tags
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