Xeon

IBM E5-2609 v2 4C 2.5GHz. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x

Lenovo Intel Xeon Bronze 3104. Processor family: Intel® Xeon®, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S. Processor package size: 76 x 56.5 mm. Compatibility: Lenovo ThinkSystem ST550

Lenovo Intel Xeon Bronze 3104. Processor family: Intel Xeon Bronze, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S

Lenovo Intel Xeon Bronze 3104. Processor family: Intel® Xeon®, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S. Processor package size: 76 x 56.5 mm. Compatibility: Lenovo ThinkSystem SR550

Lenovo Intel Xeon Bronze 3104. Processor family: Intel Xeon Bronze, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S

Intel Xeon E-2224G. Processor family: Intel Xeon E, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel UHD Graphics P630, Maximum on-board graphics card memory: 128 GB, On-board graphics card base frequency: 350 MHz. Market segment: Server, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.7 GHz

Intel Xeon E-2124G. Processor family: Intel® Xeon®, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel UHD Graphics P630, Maximum on-board graphics card memory: 128 GB, On-board graphics card outputs supported: Embedded DisplayPort (eDP),DisplayPort,HDMI,DVI. Market segment: Server, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.5 GHz

Lenovo Intel Xeon Bronze 3204. Processor family: Intel Xeon Bronze, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 2S. Compatibility: ThinkSystem SR550/SR590/SR650

Lenovo Intel Xeon Bronze 3204. Processor family: Intel Xeon Bronze, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 2S. Compatibility: ThinkSystem SR530/SR570/SR630

IBM E5-2620 v2 6C 2.1GHz. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x, Compatibility: IBM System x3500 M4

Intel Xeon E-2124G. Processor family: Intel® Xeon®, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel UHD Graphics P630, Maximum on-board graphics card memory: 128 GB, On-board graphics card outputs supported: Embedded DisplayPort (eDP),DisplayPort,HDMI,DVI. Market segment: Server, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.5 GHz

Intel Xeon E-2224G. Processor family: Intel Xeon E, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel UHD Graphics P630, Maximum on-board graphics card memory: 128 GB, On-board graphics card base frequency: 350 MHz. Market segment: Server, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.7 GHz

Lenovo E5-2620 v2. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x

Intel Xeon E3-1225V5. Processor family: Intel® Xeon® E3 v5, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 64 GB, Memory types supported by processor: DDR4-SDRAM, DDR3L-SDRAM. On-board graphics card model: Intel® HD Graphics P530, Maximum on-board graphics card memory: 64 GB, On-board graphics card outputs supported: Embedded DisplayPort (eDP), DisplayPort, HDMI, DVI. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.7 GHz

Intel Xeon E-2124. Processor family: Intel® Xeon®, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.3 GHz. Package width: 2.76" (70 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm)

Intel Xeon E-2224. Processor family: Intel Xeon E, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.6 GHz. Package type: Retail box

Intel Xeon E3-1220V5. Processor family: Intel® Xeon® E3 v5, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 64 GB, Memory types supported by processor: DDR4-SDRAM, DDR3L-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.5 GHz. Package width: 2.76" (70 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm)

Intel Xeon ® ® E-2314 Processor (8M Cache, 2.80 GHz). Processor family: Intel Xeon E, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16+1x4,2x8+1x4,1x8+3x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0,AVX-512. Intel® Turbo Boost Technology 2.0 frequency: 4.5 GHz, Maximum Enclave Size Support for Intel® SGX: 0.5 GB. Processor package size: 37.5 x 37.5 mm