Products specifications

Attribute name	Attribute value
Memory layout	1 x 4096 MB
Bus clock rate	1600 MHz
Row active time	35 ns
Width	2.66"
Height	1.18"
Chips organization	X8
Lead plating	Gold
Memory bus	64 bit
Error indication	N
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Packaging data
Package type	SO-DIMM
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Features
Internal memory	4096 MB
Internal memory type	DDR3
Memory clock speed	1600 MHz
Component for	Notebook
Memory form factor	204-pin SO-DIMM
ECC	N
Buffered memory type	Unregistered (unbuffered)
CAS latency	11
Memory voltage	1.5 V
Memory layout (modules x size)	1 x 4 GB
Memory ranking	1
Module configuration	512M X 64